CASPA/SEMI 2011 Job Fairs:

Santa Clara, California – Apr 30th, 2011 (Saturday)*

Phoenix,Tempe, Arizona – May 1st, 2011 (Sunday)*

Looking for a high tech career opportunity? Or simply want to check out how the latest job offerings in your professional field? Look no further. The CASPA/SEMI High Tech Job Fair is an excellent opportunity to talk to HR representatives and hiring managers from leading semiconductor and software companies.  Register online, get your resume ready, and come check it out. We also have professionals to help review your resume.

A.  Job Fair in Silicon Valley, CA –  April 30th, 2011 (Saturday)*

Date:    April 30, 2011, Saturday
Time: 10:00 AM – 4:00 PM
10:00 AM – 4:00 PM Job Fair (Salon 4, 5, 6)
10:00 AM – 3:00 PM Hiring Company Presentation (Salon 1)
10:00 AM – 4:00 PM Personal Career & Finance Forum (Salon 2, 3)
Venue: Marriott Hotel Santa Clara
2700 Mission College Boulevard, Santa Clara, CA 95054
Phone:             (408) 988-1500 begin_of_the_skype_highlighting (408) 988-1500 end_of_the_skype_highlighting

Registration:

Job Fair –  Please complete online registration by clicking CASPA/SEMI Job Fair Registration Form.

Personal Career and Finance Forum – Please complete online registration by clicking Personal Career and Finance Forum Registration Form.

Admission & Parking: Open to general public.*
FREE admission.  Online Registration required.   FREE Refreshments.
FREE parking (validate your parking ticket at registration desk)

Hiring companies include: AMD, AOpen, Baidu, HHNEC, Intel, Marvell, MediaTek, OmniVision, TSMC, Contact Singapore, Prudential, SEMI, foundries, EDA/CAE, test & assembly companies, tablet manufacturers, chipset companies, etc.

Personal Career and Finance Forum: This is a special forum for job seekers to learn about resume preparation, interview skill, compensation negotiation, and career change to service industry.  You will also learn about tax and retirement planning, estate planning, wealth management, and home financing.  On site resume critique will also be available.

Openings and Positions:
Software Engineer                             Web Applications Analyst

Web Designer                                    Firmware Engineer
Device Engineer/Manager                  Process Integration Manager
Module Engineer                                Vice President, R&D
Manufacturing Engineer                     QRA Engineer/Manager
Yield Enhancement Engineer              Project Manager
RF Designer                                      Analog Design Engineer
Analog Design Manager                      RFIC Designer
Physical Design Engineer                    VLSI Integration Engineer
ASIC Design Manager                        DFT Engineer
Implementation Engineer                    Verification Engineer
High Speed I/O Designer                    FPGA Engineer
CAD Engineer                                    Product Engineer
PCB Layout Engineer                          Packaging Engineer

System Architect                                Logic Design Engineer

Application Engineer                           Technical Marketing

IT Manager                                        HR/Finance/Accounting

Sales/Account Manager                       Technical Writer

B. Phoenix Job Fair, Tempe, Arizona – May 1st, 2011 (Sunday)*

1) Place: Fiesta Resort Conference Center
2100 South Priest Dr., Tempe, AZ 85282
Phone:             (480) 967-1441 begin_of_the_skype_highlighting (480) 967-1441 end_of_the_skype_highlighting
2) Date:  May 1st, 2011, Sunday
3) Time:  2:30 PM – 7:00 PM
4) Company presentations and displays: 4:00 PM – 5:30 PM, Job Fair company presentation room.
5) Company Interview Quarter:                 2:30 PM – 6:00 PM
Dedicated interview quarter is available to all participating companies for private interview.

More updated information will be posted on continued basis. Please check back often.

NOTICE: NO underage (18 years or under) guests are allowed or admitted.

High level officials from City of Zhang Jia Gang will be in Silicon Valley hosting a business lunch on April 3rd, 2011 with NACSA and CAISS. They will meet with Silicon Valley entrepreneurs and high-tech professionals; introduce their culture-rich city, share information about business development opportunities, government support initiatives, favorable investment climate, and industry outlook in China. Please plan to join us. It is a great opportunity to meet and carry on direct dialogues with decision-making local officials, build up valuable relationship for securing future government funding, and get inspired.

Resumes and business proposals will be accepted. Please download business proposal template, application forms with following links. A formal 3 course lunch will be served during the event.

Co-host: CAISS and NACSA

Date: Sunday, April 3, 2011, 10:00am to 3:00pm

Cost: Free RSVP: RSVP closed due to limited seating. Confirmation with meeting location will be sent via email.

Application Form and Business Plan Templates:

• 关于举办2011年张家港市领军型创业人才
• 关于印发张家港市引进高层次创新创业人才资助办法的通知
• 张家港市人才工作海外合作组织管理暂行办法
• 张家港市领军型创业人才报名表
• 创业计划书
• 人才项目信息简表
• 张家港宣传册
• 2009年34号张家港领军
• 张委办[2010]57号-人才资助办法

Thanks for great support from major Chinese Hi-Tech and Science Parks and NACSA members, 2011 NACSA China Trip preparation has made huge progress. We would like to announce more detailed information about this trip.

China Trip Itinerary:

• May 8, 2011 (Sunday): Report to delegation lead at the hotel
• May 9, 2011 (Monday) – May 16, 2011 (Monday)
  • Shanghai
  • Jiaxing
  • Taicang
  • Suzhou
  • Wuxi
  • Zhenjiang
  • Nanjing

Cost:

• Delegates are responsible for their own airfare to China
• $600 advanced payment for additional expenses at China

How to Join this China Trip?

• Download the Registration and BP Templates at http://www.nacsa.com/events/nacsa-business-plan-template.html and fill out them
• Submit your Registration and BP to chinatrip@nacsa.com and mail your advanced payment to us by 3/25/2011
• NACSA China Trip Committee will review your business plan and provide valuable feedback
• Finalize travel plans by 4/8/2011

For more information about 2011 NACSA China Trip, please visit our website at http://chinatrip.nacsa.com. If you have questions about NACSA 2011 China Trip or need any help, please do not hesitate to send an email to chinatrip@nacsa.com.

In Alpha and Omega Semiconductor, Inc. Discrete device integration (R&D) team

Looking for candidate who is R&D orientated with in depth knowledge and experience in semiconductor process integration, device optimization. Power MOS experience is a plus.

• Strong background in device physics, testing, and process.
• Self-motivated, good teamwork, ability to multi-task, and communicate effectively in fast paced environment.

Required Education:

MS or Ph. D in electrical engineering and/or device physics.

Other requirements:

Up to 50% travelling time

Working permit in US.

Send resume (email) to:

hchang@aosmd.com

Hong Chang (408)896-1042

SMART TECHnology World: April 19-20
Ritz-Carlton in San Francisco, CA
http://smarttechnologyworld.com/
An IDC Event

Join the SMART discussions at SMART TECHnology World!

NACSA would like to offer a special discount to all members with an additional $100 discount off the current registration price to attend SMART TECHnology World.

SPECIAL OFFER: Register today and save $100 off of the on-site price and receive IDC Semiconductor’s Predictions report for 2011 plus your choice of one special report or market model relating to topics addressed at the conference. The Semiconductor research is valued at over $3,000. Register now and take advantage of both offers!

Through this two-day, content rich agenda designed and developed by IDC, you will learn about the opportunities that are taking hold in the smart technology value chain. Gain knowledge and actionable guidance, insightful perspectives from industry leaders and IDC on the new technologies and services on the horizon for smart devices and their ecosystems.

Agenda highlights include:

Insightful keynotes and track session presentations from:

• Intel’s Ton Steenman, Vice President and General Manager, Embedded & Communications Group
• Freescale’s Lisa Su, Senior Vice President and General Manager, Networking and Multimedia
• Microsoft’s Kevin Dallas, General Manager, Windows Embedded Business
• General Motors’ Byron Shaw, Managing Director, Advanced Technology
• Samsung’s Ana Hunter, Vice President of Technology and Foundry Services
• Motorola Mobility’s Omar Javaid, Vice President, Converged Solutions
• Sprint-Nextel’s Tim Johnson, In-Vehicle Connectivity/Telematics
• Flextronics’ EC Sykes, President Flextronics Industrial
• Texas Instruments’ Deepu Talla, General Manager, OMAP Mobile Computing Business Unit
• InvenSense’s Steven Nasiri, President and CEO
• Icera’s Jim Finch, Vice President of Marketing
• Marketing Leader, Reynette Au, former VP Marketing and Alliances at Atheros and ARM
• IDC’s Mario Morales, Program Vice President, Semiconductor and EMS Research

• SMART conversations and panel discussions exploring the future of the embedded systems market

• SMART Ecosystem breakout sessions covering: consumer; next generation communications and automotive; enabling software & services; industrial & energy; manufacturing technology & supply chain

To view the complete program agenda and register today go to www.smarttechnologyworld.com.
*Be sure to use registration code Association_03 when registering.

Who Should Attend?
Over 300 world leaders across diverse markets and regions will attend, representing industries from:

· Consumer Electronics
· Service Providers
· Automotive
· Industrial
· Embedded Software
· Internet
· Financial
· Semiconductor

The titles and departments of these professionals will cover the gamut including:

· Executive Management (CTO, CMO, CIO, General Manager)
· Business Development
· Marketing & Sales
· Strategic Planning
· Product Management

There are a few opportunities left to sponsor SMART TECHnology World
Contact: Armand
Der-Hacobian

NACSA will hold an invitation-only 2011 China Trip informational session. During the meeting, you will have opportunities to learn 2011 NACSA China Trip detailed itinerary, ask questions about business plans, international travel arrangements and fees. It is the best time to meet and network with delegation members and leaders to collect all necessary information and get inspired. Please take the opportunity and join us.

Date: Thursday, March 17, 2011, 6:30-9:00pm
Venue: Will be informed after your registration
Cost: Free
RSVP: Seating is limited. Please RSVP online at http://goo.gl/HcyfS

If you have any questions, please feel free to email chinatrip@nacsa.com.

CASPA 20^th Anniversary

2011 Spring Symposium

Theme: Embedded Computing and Beyond – Core technologies empowering Smarter and Greener Solutions

Date:            March 5, 2011 (Saturday)

Time:            12:00PM – 5:00PM

Venue:          Cadence design Systems

Auditorium – Building #10

2655 Seely Avenue, San Jose, CA 95134

Format:        Language in English

Cost:            FREE with pre-registration on line.  Open to public.

Registration:  Please click CASPA Spring Symposium for online regisration.

The new waves of gadgets and endless social network internet applications have driven the demand for smarter, greener and cheaper computing solutions. Today, people are fascinated by the new dimensions of user experiences brought by visual, touching and gestural technologies. However, the core semiconductor technologies incorporated into and surrounding these gadgets are still the foundation and center of all forms of computing, event they are often forgotten and taken for granted.

The small form factor of smart phones and tablet computing today has set up new standards and requirements on IC design. Computing becomes more effective, efficient and competitive in energy, performance and cost. The smaller, smarter and greener devices are now much easier than ever to be adopted and embedded in a wider range of new applications with the available of all new platforms of mobile Operation Systems including Android, Symbian, Meego and Window Mobile. Embedded computing is reshaping the landscape of information technology in tomorrow land.

In this conference, we are honored to have some world top experts and technology veterans from key technology companies at Silicon Valley to share their views and experiences with us. They will show audiences how different technologies have evolved, and fueled the innovations in smart devices, tablet and other forms of consumer electronics. Audiences will also learn the insights from them on the future market trends and requirements in the core semiconductor industry, and the new possibilities and opportunities at embedded computing beyond our imagination.

Symposium Agenda

Noon –1:00pm         Registration & Networking

1:00 – 1:30pm         Symposium Welcome Remarks

Lee Chu, Symposium Chair and Board Director, CASPA

Dr. Donming Chen, President, CASPA

1:30 – 2:00pm         Semiconductor, Equipment and Materials Outlook

Jonathan Davis, President of Semiconductor Business, SEMI

2:00 – 2:30pm         Embedded Hard IP for SoC products– A Perspective

Rui Wang, General Manager of Hard-IP Group, Intel Corporation

2:30 – 2:45pm Break

2:45 – 3:15pm Emergence of the Embedded Processing and its impact

Ian Ferguson, Sr. Marketing Director, ARM Holdings

3:15 – 3:45pm         Embedded Memory and next wave of semiconductor advances

Charlie Cheng, Chief Executive Officer, Killopass

3:45– 4:15pm

• NACSA 2011 China Trip Registration Form
• NACSA BP Template in English
• NACSA BP Template in English Innovation
• NACSA BP Template in Chinese (创业)
• NACSA BP Template in Chinese (创新)

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2010 fiscal year (ending September 30), the company reported sales of Euro 3.295 billion with approximately 26,650 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

Infineon Technologies Xi’an Co. Ltd., established in June, 2003, is located in Xi’an High-Tech Industries Development Zone. The company is focused on creating innovative products in the fields of communications; developing Integrated circuits for new applications (system-on-chip integration) and supporting Infineon globally by IC design implementation at the lowest possible cost. Infineon Technologies Xi’an Co. Ltd. is one of the most important R&D Centers all over the world within Infineon.

1. HWA (HW architecture) Concept Engineer Urgent!!!
2. HWA (HW architecture) Concept Engineering Manager Urgent!!!
3. MOD (Modem) L1P Concept Engineer for TD-SCDMA Urgent!!!
4. MOD (Modem) Concept Engineer for FW Architect TD-SCDMA/ TD-LTE Urgent!!!
5. MOD (Modem) Concept Engineer for DSP FW Architect 2G Urgent!!!
6. Platform Concept Engineer Urgent!!!
7. Platform Concept Engineer (Feature Requirement Management) Urgent!!!
8. Digital Design and Verification Engineer
9. Design for Test (DFT) Engineer
10. Application Engineer for 3G Firmware of Cellular Devices
11. Component Verification Engineer
12. Logic Physical Synthesis Engineer

For detailed information, please click here to download the PDF file.

Send your resumes today to hr-xian@infineon.com

The executive team of Shanghai Fudan Microelectronics Group Co., Ltd will be visiting Silicon Valley this month. They are going to investigate the possibilities of establishing an operational site in Silicon Valley, and is seeking technology partners and market expansion.

If you are involved in the semiconductor chip design industry, or working on related innovative technologies, or involved in other areas such as legal, finance and marketing, and are looking for possibilities of working with Fudan Microelectronics, please join us for an informative meeting on Saturday 2/19/2011 in the afternoon. You will be able to learn about the company, its rapid growth over the past 10 years and the latest development of the semiconductor industry in China.

The company was established in 1998 and went public in Hong Kong Growing Enterprise Market in 2000, code (GEM HK: 8102.HK), please visit http://www.fmsh.com/ for more details. The executive team to be here includes VP, CTO and 3 board members of the company.

Venue: 2077 Gold Street, Alviso, CA 95002
Date: Saturday, 2/19/2011
Agenda:
2:00 – 3:00pm: Registration and Networking
3:00 – 4:00pm: Presentation by Fudan Microelectronics
4:00 – 5:00pm: Group or Private Discussion
5:00 – 7:00pm (Optional): Dinner at a local restaurant

Registration: http://fdaanc.eventbrite.com/.

If you wish to meet with the team to discuss a specific topic or proposal, please send an email to angieyuan2009@gmail.com with your contact info.

FDAANC (Fudan University Alumni Association of Northern California)