CASPA 2011 Spring Symposium

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CASPA 20th Anniversary

2011 Spring Symposium

Theme: Embedded Computing and Beyond – Core technologies empowering Smarter and Greener Solutions

Date:            March 5, 2011 (Saturday)

Time:            12:00PM – 5:00PM

Venue:          Cadence design Systems

Auditorium – Building #10

2655 Seely Avenue, San Jose, CA 95134

Format:        Language in English

Cost:            FREE with pre-registration on line.  Open to public.

Registration:  Please click CASPA Spring Symposium for online regisration.

The new waves of gadgets and endless social network internet applications have driven the demand for smarter, greener and cheaper computing solutions. Today, people are fascinated by the new dimensions of user experiences brought by visual, touching and gestural technologies. However, the core semiconductor technologies incorporated into and surrounding these gadgets are still the foundation and center of all forms of computing, event they are often forgotten and taken for granted.

The small form factor of smart phones and tablet computing today has set up new standards and requirements on IC design. Computing becomes more effective, efficient and competitive in energy, performance and cost. The smaller, smarter and greener devices are now much easier than ever to be adopted and embedded in a wider range of new applications with the available of all new platforms of mobile Operation Systems including Android, Symbian, Meego and Window Mobile. Embedded computing is reshaping the landscape of information technology in tomorrow land.

In this conference, we are honored to have some world top experts and technology veterans from key technology companies at Silicon Valley to share their views and experiences with us. They will show audiences how different technologies have evolved, and fueled the innovations in smart devices, tablet and other forms of consumer electronics. Audiences will also learn the insights from them on the future market trends and requirements in the core semiconductor industry, and the new possibilities and opportunities at embedded computing beyond our imagination.

Symposium Agenda

Noon –1:00pm         Registration & Networking


1:00 – 1:30pm         Symposium Welcome Remarks

Lee Chu, Symposium Chair and Board Director, CASPA

Dr. Donming Chen, President, CASPA


1:30 – 2:00pm         Semiconductor, Equipment and Materials Outlook

Jonathan Davis, President of Semiconductor Business, SEMI

2:00 – 2:30pm         Embedded Hard IP for SoC products– A Perspective

Rui Wang, General Manager of Hard-IP Group, Intel Corporation

2:30 – 2:45pm Break

2:45 – 3:15pm Emergence of the Embedded Processing and its impact

Ian Ferguson, Sr. Marketing Director, ARM Holdings


3:15 – 3:45pm         Embedded Memory and next wave of semiconductor advances

Charlie Cheng, Chief Executive Officer, Killopass


3:45– 4:15pm

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